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TSMC's quarterly sales hit a record $30 billion
By Anton Shilov published
After posting a record $30 billion revenue in Q2 2025, TSMC announced plans to build at least 15 new fabs worldwide.

Japanese chipmaker Rapidus begins test production of 2nm circuits — company commits to single-wafer processing ahead of 2027 mass production target
By Anton Shilov published
Rapidus has begun prototyping 2nm gate-all-around transistor structures at its IIM-1 fab in Japan as it prepares for 2027 mass production.

Intel allegedly planning more Oregon layoffs — new report says retreating operation could become a liability to the state
By Mark Tyson published
The Intel Oregon workforce is down to its lowest point in more than a decade, but there may be more cuts on the way.

Synopsys acquires simulation specialist Ansys for $35 billion following Chinese regulator approval
By Anton Shilov published
A $35 billion deal.

Exclusive: GlobalFoundries says MIPS takeover will expand its business without creating competitive friction with its clients
By Anton Shilov published
GlobalFoundries' acquisition of MIPS will not turn it into a chipmaker, but will enhance its role as a foundry by offering ready-to-use RISC-V processor IP to help customers accelerate development.

Ex-ASML employee sentenced to three years' imprisonment for sharing company secrets with Russia
By Mark Tyson published
An ex-ASML employee has been sentenced to three years imprisonment for sharing company secrets with a Russian contact.

Zombie fabs plague China's chipmaking ambitions, failures burning tens of billions of dollars
By Anton Shilov published
28 fabs later

Trump says he has struck a trade deal with Hanoi
By Jowi Morales published
Premium The U.S. and Vietnam have reached a tentative agreement that sets tariffs on Vietnamese goods at 20%, but hits transshipments with a 40% import tax.

Chipmaking giant TSMC hit with class-action lawsuit in the U.S. for bias, racism, and unsafe conditions — over 30 plaintiffs have accused the company of illegal practices at Arizona fab
By Anton Shilov published
Problems continue.

LG Innotek to slim down smartphones by replacing solder balls with copper posts
By Anton Shilov published
LG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, enabling slimmer, denser, and cooler smartphone designs.
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